ʻOihana Microelectronics

Nā kemika uilaʻIke ʻia hoʻi ʻo ia nā mea kemika uila. ʻO ka maʻamau, pili ia i ka hoʻohana ʻana o ka ʻoihana uila i nā kemika kūikawā a me nā mea kemika, e like me: nā ʻāpana uila, ka papa kaapuni paʻi, nā ʻano kemika a me nā mea i hoʻohana ʻia i ka hoʻopili ʻana a me ka hana ʻana o nā huahana ʻoihana a me nā mea kūʻai aku. Hiki ke puʻunaue ʻia i nā mea ma lalo nei e nā noi like ʻole: papa kumu, photoresist, kemika electroplating, mea encapsulating, reagents maʻemaʻe kiʻekiʻe, kinoea kūikawā, solvents, hoʻomaʻemaʻe, doping agent ma mua o ka hoʻomaʻemaʻe ʻana, solder mask, acid a me caustic, nā mea hoʻopili kūikawā uila a me nā mea kōkua, a pēlā aku. He ʻokoʻa nā kemika uila, koi kiʻekiʻe kiʻekiʻe, dosage liʻiliʻi, koi kiʻekiʻe o ke kaiapuni i nā koi maʻemaʻe, hoʻonui wikiwiki i ka huahana, ka nui o ka inflow net, waiwai hoʻohui kiʻekiʻe, a pēlā aku. ʻOi aku ka maopopo o kēlā mau ʻano me ka hoʻomohala ʻana o ka ʻenehana micro machining.

Kumu kānana:

e wehe i nā ʻāpana a me nā mea haumia colloidal;

Nā koi kānana:

1. Ma muli o ke kiʻekiʻe o ka wai kānana viscosity, pono ka hale kānana e kū i ke kaomi kiʻekiʻe a me ka ikaika mechanical.

2. Pono ka mea kānana e loaʻa i kahi kūpono maikaʻi;

3. Maikaʻi ka kānana ʻana o ka wehe ʻana i nā ʻāpana a me nā haumia colloidal.

Hoʻonohonoho kānana:

Ua kapa ʻia hoʻi ka papa kaapuni PCB he papa kaapuni i paʻi ʻia, ʻo ia ka mea hoʻolako i ka pilina uila i nā ʻāpana uila. Wahi a ka papa papa kaapuni, hiki ke hoʻokaʻawale ʻia i ka panela hoʻokahi, panela pālua, papa ʻehā papa, papa 6 papa a me nā papa kaapuni multilayer ʻē aʻe.

Kumu kānana:

e wehe i nā ʻāpana a me nā mea haumia colloidal i loko o ka wai a i ʻole ka wai;

Nā koi kānana:

1. Ka nui o ke kahe ʻana, ka ikaika mechanical kiʻekiʻe, ke ola lōʻihi.

2. Ka maikaʻi o ka kānana ʻana.

Hoʻonohonoho kānana:

Kaʻina Hana Kānana:

ʻO CMP, ʻo ia hoʻi ka Polishing Mechanical Chemical. ʻO nā lako a me nā mea hoʻopau i lawe ʻia i ka ʻenehana CMP e pili ana i: ka mīkini poli, ka polishing paste, ka polishing pad, nā lako hoʻomaʻemaʻe ma hope o ka CMP, ka ʻike ʻana i nā hopena polishing a me nā lako kaohi kaʻina hana, nā lako mālama ʻōpala a me nā lako hoʻāʻo, a pēlā aku.

ʻO ka hopena hoʻopili CMP he ʻano huahana hoʻopili metala maʻemaʻe kiʻekiʻe a me ka haʻahaʻa ionic ma o ke kaʻina hana kūikawā o ka pauka silicon maʻemaʻe kiʻekiʻe. Hoʻohana nui ʻia ia i nā ʻano mea like ʻole o ka hoʻopili planarization nanoscale kiʻekiʻe.

Kumu kānana:

e wehe i nā ʻāpana a me nā mea haumia colloidal;

Nā koi kānana:

1. Mea hoʻoheheʻe haʻahaʻa mai ka pāpaho kānana, ʻaʻohe pohō waena

2. Maikaʻi ka hiki ke wehe i nā mea haumia, lōʻihi ke ola pono.

3. Ka nui o ke kahe ʻana, ka ikaika mechanical kiʻekiʻe

Hoʻonohonoho kānana:

Kaʻina Hana Kānana: